Film for thermal laminate

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20020177005A1
SERIAL NO

09545333

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Abstract

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Disclosed is a film comprising a thermoplastic resin film, a first layer comprising a resin (A), and a second layer comprising a resin (B), in this order, wherein the resin (A) is an ethylene resin having a density of 0.900 to 0.960 g/cm.sup.3 and an MFR of 1 to 100 g/10 minutes, and the resin (B) is a straight-chain ethylene-a-olefin copolymer having a density of 0.870 to 0.910 g/cm.sup.3 and an MFR of 1 to 100 g/10 minutes, the straight-chain ethylene-a-olefin copolymer being a copolymer of ethylene with at least one .alpha.-olefin having 3 to 12 carbon atoms.

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Patent Owner(s)

Patent OwnerAddress
JAPAN POLYCHEM CORPORATION1-1 MARUNOUCHI 1-CHOME CHIYODA-KU TOKYO 1008251 ?1008251
WADA CHEMICAL INDUSTRY CO LTD10-14 HIGASHI KANDA 2-CHOME CHIYODA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yamashita, Takashi Mie, JP 203 1634

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