Dip coating of phase pure YBCO films on substrates
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United States of America Patent
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Issued Date -
Nov 21, 2002
app pub date -
Mar 6, 2001
filing date -
Mar 6, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for providing a superconductive coating on substrates by dip coating is disclosed. The dip coating formulation includes a vehicle of terpineol, butoxyethyl acetate and binder which is mixed with phase pure YBCO powder to form an ink having a viscosity ranging from 220 cPs to about 270 cPs at 100 s.sup.-1. After the substrate is dipped in the dip coating ink, it is dried and sintered. The ink formulation is prepared by dissolving the binder in the terpineol and butoxyethyl acetate solvents to create a vehicle. The phase pure YBCO powder is then mixed with the vehicle to create a dip ink formulation having the aforenoted viscosity.
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