Method for underfilling bonding gap between flip-chip and circuit substrate
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United States of America Patent
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Issued Date -
Nov 21, 2002
app pub date -
May 16, 2001
filing date -
May 16, 2001
priority date (Note) -
Abandoned
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Abstract
A method for underfilling bonding gap between flip-chip and circuit substrate is disclosed. A chip is mounted on a circuit substrate with flip-chip configuration. The circuit substrate has a top surface, a bottom surface, and a plurality of via holes. Some of the via holes are formed to be air vents passing through the top surface and the bottom surface. So that the underfill material flows into the gap between flip-chip and circuit substrate until jamming or blocking the said air vents rapidly while underfilling.
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