Dip coating of YBCO films on three dimensional substrates
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United States of America Patent
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Issued Date -
Nov 7, 2002
app pub date -
Mar 6, 2001
filing date -
Mar 6, 2001
priority date (Note) -
Abandoned
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Abstract
A method for providing a superconductive coating on three dimensional substrates by dip coating is disclosed. The dip coating formulation includes terpineol, butoxyethyl acetate, binder, dispersant, YBCO, and alcohol and has a viscosity ranging from 60 cPs to about 125 cPs. After the substrate is dipped in the dip coating formulation, it is dried, baked and then sintered. The formulation is prepared by dissolving the binder and the dispersant in the terpineol and butoxyethyl acetate solvents to create a vehicle. The YBCO is then milled with a vehicle to create a thick ink which is subsequently thinned with ethanol to produce a dip ink formulation having the aforenoted viscosity.
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