Swarf flushing system
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United States of America Patent
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Issued Date -
Oct 24, 2002
app pub date -
Feb 14, 2002
filing date -
Feb 17, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A swarf management system to remove cut material (swarf) from the surfaces of a cutting machine comprises a fluid receptacle, pump means to deliver fluid from a sump to the receptacle, and a flow line extending from the receptacle from which fluid flowing from the receptacle may be directed across a machine surface for the removal of swarf therefrom. Outflow means is provided, conveniently in the form of one or more syphons to cause fluid to flow from the receptacle only intermittently, thereby producing intermittent large volume flow of fluid over the machine surface.
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