Cascading PID control loops in CMP process
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United States of America Patent
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N/A
Issued Date -
Oct 17, 2002
app pub date -
Apr 13, 2001
filing date -
Apr 13, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention is a method and apparatus for interconnecting a plurality of control systems used to planarize wafers in a CMP tool. Example control systems that may be used with the invention are the back-fill pressure of a carrier, carrier down-force, carrier rotation and platen rotation. A controller is used to automate the CMP tool by communicating desired set-points to the various control systems. The instability or fluctuations in control systems caused by a desired change in one or more other control systems are reduced by allowing the affected control systems to receive information regarding the intended actions by the control systems that affect them. In this manner the affected control systems may take proactive steps to reduce fluctuations in their output caused by changes in the other control systems.
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