Chemical mechanical polishing method and apparatus for removing material from a surface of a workpiece that includes low-k material
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United States of America Patent
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Issued Date -
Oct 17, 2002
app pub date -
Apr 17, 2001
filing date -
Apr 17, 2001
priority date (Note) -
Abandoned
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Abstract
Improved method and apparatus for removing material from a surface of a workpiece including a low dielectric constant material are disclose. The apparatus includes a platen, having a polishing surface attached thereto, configured to orbit at more than about 500 revolutions per minute and a workpiece carrier configured to rotate and apply about 0.25 to about 2 psi. to the workpiece in the direction of the platen.
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