Power interconnect method utilizing a flexible circuit between a voltage regulation module and an integrated circuit substrate
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United States of America Patent
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Issued Date -
Oct 17, 2002
app pub date -
May 16, 2002
filing date -
Jul 15, 1999
priority date (Note) -
Abandoned
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Abstract
A method and apparatus for providing power from a first circuit board to a second circuit board is disclosed. The apparatus comprises a flex circuit having a plurality of conductive paths formed by a plurality of first conductive areas electrically coupled to a plurality of second conductive areas wherein the plurality of first conductive areas permanently and electrically coupled to a plurality of first circuit board conductive pads and the plurality of second conductive areas disconnectably and electrically coupleable to at least one second circuit board conductive pad.
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