Method for preventing metal adhesion during facet coating
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United States of America Patent
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N/A
Issued Date -
Oct 17, 2002
app pub date -
Apr 12, 2001
filing date -
Apr 12, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of eliminating the use of spacers necessary for the conventional facet coating processing of laser bars is disclosed. A low temperature dielectric layer is provided on the back side of the semiconductor laser bar to prevent the metal from the solder/metal contacts from adhering to an adjacent laser bar during facet coating processing. In another embodiment, a low temperature dielectric layer is provided on the back side of the semiconductor laser bar and then patterned to form various alignment marks that provide contrast for the subsequent identification and alignment of the laser bar in an automated bonding vision system.
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