Importance

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Abstract

A method and apparatus for treating a workpiece using capillary discharge plasma are disclosed in the present invention. More specifically, a method of desmearing holes in a copper laminated board and forming a conductive material in the holes using an atmospheric pressure capillary discharge plasma apparatus having at least one first electrode receiving a power source, a dielectric body having first and second sides, the first side coupled to the first electrode and the second side having at least one capillary extending to a direction of the first side of the dielectric body, and each capillary substantially aligned with each electrode, and a second electrode electrically coupled to the first electrode, the method comprising the steps of drilling the copper laminated board to remove at least a portion of the copper laminated board, placing the copper laminated board having the holes in the apparatus, applying a potential to the plasma generator, providing a working gas in close proximity to the copper laminated board, generating capillary discharge plasma out of the capillary, thereby treating the copper laminated board with the atmospheric pressure capillary discharge plasma to remove resin residues in the holes, and forming the conductive material on the copper laminated board including in the holes.

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First Claim