Focused magnetron sputtering system
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Oct 10, 2002
app pub date -
Jan 30, 2002
filing date -
Feb 9, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A focused magnetron sputter system includes a processing chamber, a plurality of sputter sources arranged within the processing chamber, a substrate holder disposed above the plurality of sputter sources, a rotational shutter arranged between a substrate and the plurality of sputter sources for selectively forming a coating on the substrate, and a power supply connected to the substrate holder for supplying a substrate bias.
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