Electroconductive adhesive tape
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United States of America Patent
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N/A
Issued Date -
Oct 3, 2002
app pub date -
May 29, 2001
filing date -
Mar 29, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to an electroconductive adhesive tape used for electrical and electronic products to bond or fix an element to a support while maintaining an electrical conductivity between the element and support. The electroconductive adhesive tape comprises a perforated synthetic film, two metal plating layers respectively formed on both surfaces of the synthetic resin film, and a conductive adhesive layer formed on one of the metal plating layers. Made to be very thin, the film has the advantage of being flexible and high in tensile strength in addition to showing excellent electrical conductivity. The metal plating layers are integratedly formed through the perforations of the synthetic resin film, maintaining excellent electrical conductivity. Thus, the electroconductive adhesive tape maintains a desired strength while exhibiting a high flexibility and a high bondability.
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