AIN substrate and method for preparing such substrate for bonding to a copper foil
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United States of America Patent
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Issued Date -
Oct 3, 2002
app pub date -
Mar 11, 2002
filing date -
Mar 16, 2001
priority date (Note) -
Abandoned
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Abstract
An AlN substrate is disclosed that can be bonded to a copper foil by a direct-copper-bonding (DCB) method. The bonding surface of the AlN substrate includes at least one auxiliary layer containing at least 50 wt. % CuAlO.sub.2 and an excess of Cu.sub.2O. Also disclosed is a process for preparing the auxiliary layer by applying a material containing copper, copper oxide and/or other copper-containing compounds, followed by an oxidation and reduction process.
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