EMBEDDED METALLIC DEPOSITS
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United States of America Patent
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N/A
Issued Date -
Oct 3, 2002
app pub date -
Nov 3, 1999
filing date -
Nov 3, 1999
priority date (Note) -
Abandoned
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Abstract
A method of making a set of metallic deposits includes injection molding a substrate, where a pattern of channels is in a surface of the substrate, applying a metallic layer on the surface, to form metallic deposits in the pattern, and removing a portion of the metallic layer, to expose a portion of the surface. The set of metallic deposits can form an electrode set for an electrochemical sensor strip.
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