Electrostatic chuck having bonded structure and method of manufacturing the same
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United States of America Patent
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Mar 28, 2006
Grant Date -
Oct 3, 2002
app pub date -
Jan 10, 2002
filing date -
Jan 30, 2001
priority date (Note) -
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Abstract
An electrostatic chuck and a method for manufacturing the same are provided. The electrostatic chuck has a bonded structure comprising a ceramic electrostatic chuck member, a metal member and a bonding layer. The bonding layer has at least a first outermost bonding layer joined to the ceramic electrostatic chuck member, a second outermost bonding layer joined to the metal member, and an intermediate polyimide layer disposed between the first and second outermost bonding layers. Each of the outermost bonding layers are made of a silicone layer or an acrylic.
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