Method for forming bumps
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United States of America Patent
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N/A
Issued Date -
Sep 26, 2002
app pub date -
May 11, 2001
filing date -
Mar 22, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of forming a bump on a wafer is provided. A thick photoresist having a plurality of openings is formed on the wafer to expose the bonding pads. A solder paste is filled in the openings of the thick photoresist. A stencil that has a plurality of openings corresponding to those of the photoresist is applied over the wafer. After the stencil is removed, a reflow process is carried out to form bumps. The thick photoresist is then removed. The bumps are formed in two steps using a thick photoresist and a stencil, resulting in an increased height and uniformity after reflow.
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