Object sensor with integrally molded housing and method for making same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Sep 19, 2002
app pub date -
Dec 29, 2000
filing date -
Dec 29, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A sensor such as a proximity sensor or object device which has transceiver means for transmitting a signal and receiving a return signal reflected off of an object within a range of the transceiver means and a thermoplastic compound surrounding and directly contacting a portion of at least the transceiver means. The thermoplastic compound is a melt processible injection moldable material such as thermoplastic polyamides, thermoplastic polyesters, acetal resins, as well as mixtures of these materials.
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