Substrate layout method and structure for reducing cross talk of adjacent signals
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United States of America Patent
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N/A
Issued Date -
Aug 29, 2002
app pub date -
Mar 19, 2001
filing date -
Dec 15, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention provides a substrate layout method and structure of a ball grid array to reduce cross talk of adjacent signals. The substrate comprises a plurality of signal pads formed on a die, a ring around the die, and a plurality of signal fingers around the ring. The substrate layout method for reducing cross talk of adjacent signals is as follows: First, forming a guard pad between two adjacent signal pads. Second, forming a guard finger between two adjacent signal fingers. Next, forming a bonding wire to connect the guard pad to the ring. Then, forming another bonding wire to connect the ring to the guard finger. Subsequently, forming a guard trace to connect the guard finger to a via at the edge of the substrate, and connecting the guard trace to a short-circuiting place through the via.
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