Method and system for cooling at least one laser diode with a cooling fluid
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United States of America Patent
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N/A
Issued Date -
Aug 15, 2002
app pub date -
Feb 14, 2001
filing date -
Feb 14, 2001
priority date (Note) -
Abandoned
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Abstract
A method and system for cooling at least one laser diode with a cooling fluid which does not come into direct contact with the at least one laser diode is presented. Liquid cooled heat sinks are provided on opposing sides of each laser diode. Individual modules are held together by a single holding mechanism allowing individual modules to be removed from the array for easy testing or replacement.
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