Process for modifying chip assembly substrates
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United States of America Patent
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Issued Date -
Aug 1, 2002
app pub date -
Aug 2, 2001
filing date -
Aug 3, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of modifying a chip assembly substrate comprising the steps of: treating a selected area of the substrate to provide the selected area with a predetermined charge; texturing the selected area of the substrate to affect the texture of the substrate surface; depositing an electro-less plating catalyst, having an opposite charge to that of the predetermined charge, to at least the selected area of the substrate such that the catalyst remains affixed to the selected area of the substrate only; and modifying the chip assembly substrate by electro-less plating the chip assembly substrate, only those areas to which the catalyst remains affixed being electro-less plated.
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