Abrasive free polishing in copper damascene applications
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United States of America Patent
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Issued Date -
Jul 25, 2002
app pub date -
Jan 19, 2001
filing date -
Jan 19, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An abrasive free wafer polishing device utilizing an abrasive free chemical solution includes a workpiece fixture (11), a brush assembly (12) and a high flow rate fluid dispenser (13). The fluid dispenser (13) dispenses an abrasive free chemical solution to an interface at which the workpiece and the brush assembly come into contact with a flow rate of at least 50 ml/min. The abrasive free chemical solution and brush assembly (12) operate to chemically react with a metal (e.g. copper) on the workpiece and abrade away the reacted copper during a polishing process.
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