Intermediate support for supporting a semiconductor module on a circuit carrier
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Jul 25, 2002
app pub date -
Dec 14, 2001
filing date -
Dec 14, 2000
priority date (Note) -
Abandoned
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Abstract
An intermediate support which supports a semiconductor module on a printed circuit board has, on its underside, contact studs which are integrally formed from plastic and are intended for the contact-connection to the printed circuit board. The support is also provided with supporting studs which are preferably arranged in a comer region and are connected to the printed circuit board to improve the thermomechanical reliability of the semiconductor module.
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