Method and apparatus for balling and assembling ball grid array and chip scale array packages
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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N/A
Issued Date -
Jul 18, 2002
app pub date -
Apr 19, 2001
filing date -
Nov 5, 1999
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method and apparatus are provided for attaching conductive materials to a substrate and for attaching a semiconductor chip to a substrate. A pallet is provided with pockets to hold the conductive materials, the substrate is placed over the pallet, and the semiconductor chip is placed over the substrate. The assembled semiconductor package is then placed in a heating oven or reflowed and the conductive materials and semiconductor chip are simultaneously attached to the substrate. Also provided is a stencil for varying the pockets into which the conductive materials are placed. In uses involving the stencil, a pallet with a full array of pockets is used and a stencil with holes corresponding to the desired pattern of application of the conductive materials is placed over the pallet. When the conductive materials are applied over the stencil, they fill only those pockets in the pallet that correspond to the desired pattern of application.
First Claim
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International Classification(s)
Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- B23K Class
- 4.54 % this patent is cited more than
- 23 Age