Sputter chamber shield
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jul 11, 2002
app pub date -
Nov 20, 2001
filing date -
Nov 28, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Particulate contamination can occur in physical vapor deposition (PVD) systems when sputtered target material accumulates on the walls of the processing chamber and flakes off onto the workpiece. In a method for preparing a shield to reduce particulate contamination, sheet metal is formed to conform to the surfaces of the deposition chamber. The base metal is roughened, such as by sand blasting. A layer of coating material, whose coefficient of thermal expansion (CTE) is similar to that of the target material, is applied to the roughened base metal surface by a thermal spraying process. The surface of the coating is very rough, more than five times rougher than the underlying base metal texture. When the coating CTE and surface roughness are chosen carefully, shield performance can be optimized, resulting in longer processing times between shield replacements, reduced PVD chamber maintenance and less down time in these systems.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
STEAG HAMATECH AG | 75447 STERNENFELS |
International Classification(s)

- 2001 Application Filing Year
- C23C Class
- 1423 Applications Filed
- 532 Patents Issued To-Date
- 37.39 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Jiang, Mingwei | Sunnyvale, CA | 6 | 101 |
# of filed Patents : 6 Total Citations : 101 | |||
Shkolnikov, Mikhail | San Jose, CA | 1 | 61 |
# of filed Patents : 1 Total Citations : 61 |
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Patent Citation Ranking
- 61 Citation Count
- C23C Class
- 93.18 % this patent is cited more than
- 23 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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