Method of forming solder bumps
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Jul 4, 2002
app pub date -
Jan 17, 2001
filing date -
Dec 29, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of forming solder bumps provides a wafer, which comprises a plurality of I/O pads, a passivation layer, an isolating metal layer and a UBM layer. A photoresis layer is formed on a location of forming solder sump on the UBM layer. A portion of the UBM layer that is situated outside the location of forming solder bump is removed. The underlying isolating metal layer is exposed. A thick photoresist layer is applied on the UBM layer and the isolating layer, wherein by exposing and photolithography methods to remove the thick photoresis layer, which is formed on the locations of forming solder bumps. A printing method is used to fill a solder paste into an opening of the photoresist later. A reflow process is carried out to reflow the solder paste. After the reflow process, the photoresist layer is removed, and finally the isolating metal layer is also removed. A wafer with solder bumps is thus formed.
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