Tightening rings for integrated circuit tester heads

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20020079884A1
SERIAL NO

10053506

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to an assembly ring, on a test head, of a wafer that provides an interface of electric contact transfer between the test head and a circuit to be tested, including a disk, open in its central portion and meant for supporting the periphery of the wafer; a removable collar assembly of the ring on the test head; and means for rotatably connecting the disk in the vicinity of a free end of the collar.

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Patent Owner(s)

Patent OwnerAddress
SGS-THOMSON MICROELECTRONICS S A7 AVENUE GALLIENI 94250 GENTILLY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bailly, Jean-Michel Allevard, FR 2 0
Girolet, Bernard Grenoble, FR 2 0
Milesi, Roger Saint Martin D'Uriage, FR 2 0
Noraz, Denis Saint Nazaire Les Eymes, FR 2 0

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