Panel units having in situ formed moldings
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Jun 20, 2002
app pub date -
Dec 18, 2001
filing date -
Dec 18, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Methods for manufacturing panel units may include applying a cover tape to a surface of a panel in such a way as to substantially extend along a periphery of the panel. An extrusion molding die may be moved relative to the panel in such a way that the extrusion molding die moves along the periphery of the panel while at least partially contacting the cover tape applied to the panel. At the same time, a molten molding material may be extruded from the extrusion molding die, thereby integrally forming a molded article on the periphery of the panel. The cover tape may be then removed from the surface of the panel in order to produce a panel unit having the molded article disposed along the periphery of the panel.
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