Integrated optical device
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United States of America Patent
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Issued Date -
Jun 20, 2002
app pub date -
Dec 15, 2000
filing date -
Dec 14, 2000
priority date (Note) -
Abandoned
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Abstract
A method of fabricating an integrated optical device comprising an optically conductive layer (6) separated from a substrate (2) by an optical confinement layer (3) comprising forming the device by bonding two separate parts (1, 4) together at an interface (4A) therebetween and forming a first feature (5) at the interface (4A) by processing at least one (4) of the two parts before the two parts (1,4) are bonded together. The method is particularly applicable to fabricating devices in silicon-on-insulator with the feature (5) located away from the outer surface thereof.
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