Alignment correction prior to image sampling in inspection systems
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United States of America Patent
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N/A
Issued Date -
Jun 20, 2002
app pub date -
Jan 31, 2002
filing date -
Oct 2, 1995
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, the those electronic images are compared to detect any defects that may exist on one of the die.
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