Mixed acid solution in etching process, process for producing the same, etching process using the same and process for producing semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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N/A
Issued Date -
Jun 13, 2002
app pub date -
Jul 27, 2001
filing date -
Jul 31, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
There is disclosed an etching solution containing at least hydrofluoric acid, nitric acid and hexafluorosilicic acid wherein the concentration of hexafluorosilicic acid is not less than 10% by weight based on the weight of the etching solution.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
MITSUBISHI CHEMICAL CORPORATION | 1-1 MARUNOUCHI 1-CHOME CHIYODA-KU TOKYO 100-8251 | |
NIPPON KASEI CHEMICAL COMPANY LIMITED | FUKUSHIMA-KEN |
International Classification(s)

- 2001 Application Filing Year
- H01L Class
- 12651 Applications Filed
- 6832 Patents Issued To-Date
- 54.01 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Haga, Sadao | Kitakyushu-shi, JP | 1 | 8 |
# of filed Patents : 1 Total Citations : 8 | |||
Itou, Katsuji | Iwaki-shi, JP | 4 | 30 |
# of filed Patents : 4 Total Citations : 30 |
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Patent Citation Ranking
- 8 Citation Count
- H01L Class
- 1.35 % this patent is cited more than
- 23 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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