Method for making holes in a substrate

United States of America Patent

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Issued Date
Jun 13, 2002
app pub date
Dec 8, 2000
filing date
Dec 8, 2000

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Abandoned

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Abstract

A method for making holes in a substrate includes steps of cleaning a surface of the substrate and boring the blind holes in the surface of the substrate with laser beams.

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Patent Owner(s)

Patent Owner	Address
COMPEQ MANUFACTURING CO LTD	NO 91 LN 814 DAXIN RD SHIN-JUANG VILLAGE LUZHU DIST TAOYUAN CITY 338

International Classification(s)

B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....

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Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Cheng, Wen-Chung	Lu Chu Hsiang, TW	3	18
Chu, Guan-Po	Lu Chu Hsiang, TW	1	0
Huang, Hsin-R	Lu Chu Hsiang, TW	1	0

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Method for making holes in a substrate

Number of patents in Portfolio can not be more than 2000

United States of America Patent

09732970

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09732970

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