Definable integrated passives for circuitry
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United States of America Patent
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N/A
Issued Date -
May 30, 2002
app pub date -
Nov 9, 2001
filing date -
May 4, 1998
priority date (Note) -
Abandoned
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Abstract
A method of fabricating a passive integrated circuit. The integrated circuitry is fabricated in a single plane, the circuitry including passive components such as capacitors, resistors, and inductors. The method features the steps of forming on a substrate a first pattern of conductive material and a first set of passive component elements, and depositing a patterned dielectric layer onto the substrate. The first pattern of conductive material provides electrical connectivity to the first set of passive component elements. An apparatus fabricated according to method is disclosed
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