ENHANCED THERMAL COUPLING FOR ELECTRONIC BOARDS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
May 9, 2002
app pub date -
May 12, 1999
filing date -
May 12, 1999
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An improved electronic board assembly in which thermal conductivity is greatly increased through the use of thermally conductive plug placed within the vias. Within a via, usually having its walls coated with copper, a thermally conductive plug (such as copper) is placed; this plug is then secured to the via and the electronic board by flowing and solidifying solder around the plug. Due to the heightened thermal characteristics of the plug, heat is more efficiently wicked away from the electronic elements to a heat sink or heat dissipation mechanism.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully