Heat sink for electronic parts and manufacture thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Apr 18, 2002
app pub date -
Mar 21, 2001
filing date -
Oct 12, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Heat dissipation fins 12 provided on a metal flat plate 10 with a predetermined distance and a metal base plate provided with a plurality of bottom-expanded recesses 15 on the flat surface 14 with a predetermined distance are prepared and pressing portions corresponding to the bottom-expanded recesses on the flat plate between fins to press down protrusions provided on the back side of the flat plate into the bottom-expanded recesses to fix the heat dissipation fins and the base plate securely. Number of components of the heat sink is reduced and construction has become simple. The manufacturing cost is reduced.
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