Material deposition
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United States of America Patent
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Issued Date -
Mar 28, 2002
app pub date -
Dec 28, 2000
filing date -
Jun 30, 1998
priority date (Note) -
Abandoned
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Abstract
A method of material deposition of a desired material onto a substrate comprises the steps of: (i) depositing a surface-covering layer onto the substrate; (ii) depositing the desired material onto the surface-covering layer; and (iii) heating the substrate to a surface-covering removal temperature to remove at least some of the surface-covering layer. Steps (ii) and (iii) may be carried out together, so that the deposition of step (ii) may be carried out at least in part at the surface-covering-removal temperature.
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