Method and component for forming an embedded resistor in a multi-layer printed circuit
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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N/A
Issued Date -
Feb 21, 2002
app pub date -
Mar 12, 2001
filing date -
Aug 18, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
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Abstract
A component for use in forming a multi-layer printed circuit comprised of a film substrate formed of a first polymeric material. At least one layer of a flash metal is applied to a first side of the film substrate, and at least one layer of copper is applied on the layer of flash metal. A discrete area of an organic molecular semiconductor material is disposed on a second side of the film substrate.
First Claim
Other Claims data not available
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| Country | kind | publication No. | Filing Date |
|---|---|---|---|
| US | B1 | US6284982 | Aug 18, 2000 |
| US | A1 | US20020050400 | Apr 05, 2001 |
| US | A1 | US20020020553 | Apr 05, 2001 |
International Classification(s)
- 2001 Application Filing Year
- H01C Class
- 213 Applications Filed
- 72 Patents Issued To-Date
- 33.81 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 2 Citation Count
- H01C Class
- 5.56 % this patent is cited more than
- 23 Age