Optical critical dimension metrology system integrated into semiconductor wafer process tool
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United States of America Patent
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Issued Date -
Feb 14, 2002
app pub date -
Aug 10, 2001
filing date -
Aug 11, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A wafer measurement station integrated within a process tool has a scatterometry instrument for measuring patterned features on wafers. A wafer handler feeds wafers between a cassette and one or more process stations of the process tool. Wafers presented to the measurement station are held on a wafer support, which may be moveable, and a scatterometry instrument has an optical measurement system that is moveable by a stage over the wafer support. A window isolates the moveable optics from the wafer. The optical measurement system are microscope-based optics forming a low NA system. The illumination spot size at the wafer is larger than a periodicity of the patterned features, and data processing uses a scattering model to analyze the optical signature of the collected light.
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