Resin sealing method and resin sealing apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Feb 14, 2002
app pub date -
Jun 20, 2001
filing date -
Jun 20, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Loading Importance Indicators... 
Abstract
Under-fill molding is carried out by preferentially sending a sealing resin 22 under pressure into a clearance portion 21 between a semiconductor chip 6 and a substrate 2, and a molded component gate runner 25 that is connected to the under-fill portion 24 is separated at the substrate end position.
Loading the Abstract Image...
OK
First Claim
Family
Loading Family data...
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully