Apparatus and method for controlling boiling conditions of hot phosphoric acid solution with pressure adjustment
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 6, 2004
Grant Date -
Jan 24, 2002
app pub date -
Feb 28, 2001
filing date -
Jun 8, 2000
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Disclosed is an apparatus and method for controlling boiling condition of hot H.sub.3 PO.sub.4 solution by adjusting the vapor extracting rate thereof, wherein an acid tank filled with hot H.sub.3 PO.sub.4 solution to a level surface is located in a treatment room and a temperature thermocouple is arranged above the level surface of the hot H.sub.3 PO.sub.4 solution to monitor the vapor temperature near the level surface of the H.sub.3 PO.sub.4 solution. The vapor temperature is used to adjust the extracting rate of the treatment room by control of a damper connected to an outlet of the treatment room. According to the present invention, the treatment apparatus and method can control the boiling condition of the hot H.sub.3 PO.sub.4 solution thereof by properly adjusting the extracting rate, and therefore avoid defects and loss of control in manufacturing processes.
First Claim
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Family
Country | kind | publication No. | Filing Date | Type | Sub-Type |
---|---|---|---|---|---|
TW | B | TW512131 | Jun 08, 2000 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
GRANTED PATENT OR PATENT OF ADDITION | Apparatus and method for controlling boiling conditions of hot phosphoric acid solution with pressure adjustment | Dec 01, 2002 |
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
PROMOS TECHNOLOGIES INC | 3F NO 19 LI-HSIN ROAD SCIENCE-BASED INDUSTRIAL PARK HSIN CHU CITY |
International Classification(s)

- 2001 Application Filing Year
- C23F Class
- 479 Applications Filed
- 107 Patents Issued To-Date
- 22.34 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Chiu, John | Hsinchu, TW | 18 | 429 |
# of filed Patents : 18 Total Citations : 429 |
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Patent Citation Ranking
- 7 Citation Count
- C23F Class
- 5 % this patent is cited more than
- 21 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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