Water-permeable adhesive tape
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Dec 27, 2001
app pub date -
Mar 28, 2001
filing date -
Mar 30, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to a water-permeable adhesive tape for processing semiconductor wafers and/or semiconductor related materials comprising at least one base film and an adhesive, wherein said at least one base film possesses perforations and has a cavity ratio of 3.0 to 90%. The water-permeable adhesive tape is in particular suitable for dicing semiconductor wafers and/or semiconductor related materials using laser technology.
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