PROCESS FOR PATTERNING CONDUCTIVE LINE WITHOUT AFTER-CORROSION
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Nov 15, 2001
app pub date -
Jul 6, 1999
filing date -
Jul 9, 1998
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
An aluminum-copper alloy layer is patterned through a photo-lithography followed by a dry etching, and side walls of etching residue containing aluminum chloride, which is causative of after-corrosion in the aluminum-copper alloy line, is grown during the dry etching, wherein the side walls are exposed to gaseous mixture containing ionic water vapor so that hydrogen ion and/or the hydroxyl group reacts with the aluminum chloride, thereby converting the aluminum chloride to aluminum and/or aluminum hydroxide and hydrochloric acid vaporized into vacuum.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully