Inter-circuit encapsulated packaging
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
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app pub date -
Jun 19, 2001
filing date -
Jul 15, 1999
priority date (Note) -
Abandoned
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Abstract
An encapsulated circuit assembly and a method for making an encapsulated circuit assembly are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a heat transfer device. The second printed circuit board comprises a heatsink, and the heat transfer device couples between a device mounted on the first printed circuit board and the second printed circuit board for transferring heat from the device to the heatsink of the second printed circuit board.
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