High rigidity, multi-layered semiconductor package and method of making the same
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United States of America Patent
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Issued Date -
Nov 8, 2001
app pub date -
Jan 10, 2001
filing date -
Apr 6, 2000
priority date (Note) -
Abandoned
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Abstract
The present invention provide a plurality of layered substrates for semiconductor packages. The substrates include, for example, a metal matrix composite layer and at least one carrier layer having a coefficient of thermal expansion and a thermal conductivity greater than the metal matrix composite. In the preferred embodiment, the metal matrix composite includes between approximately 50% to 95% refractory metal with the remainder copper. Suitable carrier layer materials include, for example, copper. So configured, the layered substrates provide improved rigidity and thermal characteristics for matching with ceramic materials.
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