Process and device for punching thin films
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Nov 8, 2001
app pub date -
Apr 5, 2001
filing date -
Apr 5, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A process is provided for punching a thin film (2), preferably one formed of a plastic, as well as a punching device for carrying out the process. In the process, the thin film (2) is fed by a feed device (1) to a downstream punching station (4) and transferred to a downstream processing station (13) after the punching operation. The thin film (2) to be punched is joined with a self-sticking reinforcing film (9) on the side facing away from the punching tool before being fed to the punching station (4).
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