EMI and RFI shielding for printed circuit boards
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Oct 25, 2001
app pub date -
Feb 16, 2001
filing date -
Apr 21, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention provides a vacuum deposited metal layer that can shield the electronic components on a PCB or FPC. The vacuum metallized conductive layer can be grounded to a ground trace on the circuit board to create a Faraday cage to protect the electronic components disposed on the circuit board from EMI. The metallized conductive layer can be disposed over an encapsulating insulative layer or onto a shaped thermoform or mold injected plastic substrate that is coupled to the PCB or FPC.
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