Thermal/mechanical springbeam mechanism for heat transfer from heat source to heat dissipating device
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United States of America Patent
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N/A
Issued Date -
N/A
app pub date -
Mar 2, 2001
filing date -
Jul 15, 1999
priority date (Note) -
Abandoned
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Abstract
A method, apparatus, and article of manufacture for transferring heat is disclosed. The apparatus comprises a first thermally conductive plate; a second thermally conductive plate; and an angularly corrugated member disposed between and in thermal communication first thermally conductive plate and the second thermally conductive plate. The angularly corrugated member has a contiguous periodically repeating cross section which includes a first cross section segment, disposable substantially parallel to and in thermal communication with the first thermally conductive plate, a second cross section segment, disposable substantially parallel to and in thermal communication with the second thermally conductive plate, and a third cross section segment, communicatively coupled to the first surface and the second surface, wherein the third cross section segment forming an angle with the first thermally conductive plate.
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