Multilayered RF signal transmission circuit and connecting method therein
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Oct 25, 2001
app pub date -
Mar 6, 2001
filing date -
Apr 6, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A multilayered RF signal transmission circuit includes an interlevel via hole comprised of a trunk via hole and a branch via hole. The trunk via hole is formed to pass through a region where a plurality of conductors overlap in a direction perpendicular to planes including them, and to run in a direction perpendicular to a signal transmission direction of the plurality of conductors. The branch via hole runs from each end in a longitudinal direction, along which the trunk via hole runs, of the trunk via hole for a predetermined length substantially symmetrically at a predetermined angle with respect to a direction perpendicular to the longitudinal direction.
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