Circuit board interconnect
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Aug 13, 2002
Grant Date -
Oct 18, 2001
app pub date -
Dec 5, 2000
filing date -
Feb 11, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Interconnection apparatus is provided which is especially useful to mount and connect circuit boards having a contact assembly of resilient compressive contacts to a backplane or other mateable board or device. The apparatus includes an enclosure having guide channels for each board to be housed in the enclosure, a contact assembly for providing compressive contact between the contact ends of each board and corresponding contacts of the backplane, and elements for seating each board into engagement with the backplane.
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