Method for anisotropic etching of structures in conducting materials
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United States of America Patent
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Issued Date -
Sep 27, 2001
app pub date -
Mar 1, 2001
filing date -
Sep 6, 1996
priority date (Note) -
Abandoned
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Abstract
A method for plating an electrically conductive substance, which includes the steps of contacting the electrically conductive substance with a plating agent in dilute solution, in which the plating agent is present in a concentration of 200 mM at most, and subjecting the plating agent adjacent to the electrically conducive substance to an electric field.
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