Slurry for chemical mechanical polishing
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
Aug 30, 2001
app pub date -
Dec 20, 2000
filing date -
Dec 28, 1999
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to a slurry used for chemical mechanical polishing of a substrate having an insulating film and a tantalum-containing metal film formed on the insulting film, which slurry contains a silica abrasive and a polycarboxylic acid such as oxalic acid, malonic acid, tartaric acid, malic acid, glutaric acid, citric acid, maleic acid or the like. According to the present invention, a buried electric connection of high reliability and excellent electrical properties can be formed at a high polishing rate, i.e. at a high throughput with the generation of dishing and erosion being suppressed.
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